Intel readies Centrino 2

The platform is expected to offer faster memory and a further focus on reduced power consumption.

Formerly codenamed Montevina, the new platform combines Penryn-class mobile processors with a chipset supporting DDR3 memory and 802.11a/b/g/n Wi-Fi support.

Some versions of the platform will also support the WiMax wide-area network standard.

The platform is expected to use new processor chips that fit a 25W thermal design envelope, down from 35W, according to Intel.

itweek.co.uk @ 2010 Incisive Media

centrino hardware intel readies