The platform is expected to offer faster memory and a further focus on reduced power consumption.
Formerly codenamed Montevina, the new platform combines Penryn-class mobile processors with a chipset supporting DDR3 memory and 802.11a/b/g/n Wi-Fi support.
Some versions of the platform will also support the WiMax wide-area network standard.
The platform is expected to use new processor chips that fit a 25W thermal design envelope, down from 35W, according to Intel.
Intel readies Centrino 2
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