AMD, Samsung collaborate on next-gen memory for AI systems

Samsung Electronics has signed a memorandum of understanding (MoU) with chipmaker AMD to expand their collaboration on next-generation memory and computing technologies.

Under the MoU, the companies will collaborate on HBM4 supply for the next-generation AMD Instinct MI455X GPU AI accelerator, along with advanced DRAM solutions for 6th gen AMD EPYC CPUs.

According to the two companies, these technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures like the AMD Helios platform.

Samsung claims its HBM4 is an industry-first to enter mass production and is built on its most advanced 6th-generation 10-nanometer (nm)-class DRAM process (1c) and a 4nm logic base die, featuring processing speeds of up to 13 gigabits-per-second (Gbps) and maximum 3.3 terabytes-per-second (TB/s) bandwidth that exceeds industry standards.

As part of their collaboration, Samsung and AMD will also work together on high-performance DDR5 memory optimised for the 6th Gen AMD EPYC CPUs, with the companies aiming to deliver DDR5 memory solutions for systems built on the AMD Helios rack-scale architecture. 

Samsung and AMD plan to discuss opportunities for foundry partnership, through which Samsung would provide foundry services for next-generation AMD products.

"Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration," said Young Hyun Jun, vice chairman and CEO of Samsung Electronics.

"From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD’s evolving AI roadmap."

"We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms," said Dr. Lisa Su, chair and CEO of AMD.

"Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”

Samsung and AMD have collaborated for nearly two decades across graphics, mobile and computing technologies, including Samsung serving as the primary HBM3E partner to AMD, powering the latest AMD Instinct MI350X and MI355X AI accelerators.