Vertiv launches new cooling system for AI data centres

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Vertiv launches new cooling system for AI data centres

Vertiv has unveiled a new cooling solution designed specifically for artificial intelligence and high-performance computing applications, promising significant improvements in energy efficiency and space utilisation.

The Vertiv CoolLoop Trim Cooler integrates with high-density, liquid-cooled environments to deliver up to 70 per cent reduction in annual cooling energy consumption and 40 per cent space savings compared to traditional systems.

Cheehoe Ling, vice president of product management for Asia at Vertiv, said the system was developed to address the region's rapidly growing demand for AI infrastructure.

"Asia's rapid digital transformation and AI-driven growth demand innovative cooling solutions that can handle high heat densities while improving energy efficiency," Ling said.

"The Vertiv CoolLoop Trim Cooler is ideal for the region's diverse climate conditions, providing scalable, high density cooling that reduces energy use and operational complexity."

The system supports fluctuating supply water temperatures up to 40°C and cold plate functionality at 45°C, making it suitable for modern AI factories.

It uses low-global warming potential refrigerant and offers scalable cooling capacity up to almost 3 megawatt in air-cooled configuration.

Vertiv says its free cooling coils are optimised for high ambient temperatures, allowing the system to operate in free cooling mode across more seasons and conditions, reducing electrical consumption and carbon emissions.

The company highlighted that the CoolLoop Trim Cooler is compliant with upcoming 2027 EU F-GAS regulations, avoiding the need for costly redesigns or infrastructure upgrades to meet future regulatory requirements.

The system features straightforward water connections for direct integration with Vertiv CoolChip CDU coolant distribution units for direct-to-chip cooling, and can also connect directly to immersion cooling systems.

This simplified installation process improves compatibility across high-density cooling environments and offers time and cost efficiencies for customers, according to the company.

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